Companies » Industrial Products, Machinery & Equipment
HillTron Corporation offers both lead-free & leaded soldering options on PCB assembly flex circuit assembly rigid flex assembly and wafer substrate assembly. Alloy used for lead-free solder is tin-silver-copper (Sn95/Ag3.5/Cu0.7) with a melting range of 217-220 deg C. We assemble or re-work BGA Micro-BGA CSP QFN SON and similar packages. We have re-worked BGAs with 1400 pins & heat sinks on it.
| Business Type: | Manufacturer |
|---|---|
| Product/Service Labels: | Manufacturing, Metals, Machinery & Engineering |
| Cooperation | |
| We Offer (Available Partnerships): | Product Line Contract Manufacturing Distributor |
| Contact Details | |
| Position: | Sales and Marketing |